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Additive Manufacturing and Functional Materials Symposium

Conference Web Site: bit.ly/UW3DPrint2017

Additive Manufacturing and Functional Materials Symposium
Thursday and Friday, June 22-23, 2017
Kane Hall, University of Washington, Seattle

The University of Washington is proud to announce its second interdisciplinary 3-D Printing Symposium:

For information about last year’s inaugural additive manufacturing symposium, you may find a summary at Open3DP.

Hosted by the UW Strategic Research Initiative for Additive Manufacturing, this two day-long event offers an unprecedented chance to witness the latest advances in 3-D printing and scholastic research for one of the most critical societal opportunities in modern history.

This 2-day symposium will bring together an international audience from industry and academia to discuss the cutting edge of additive manufacturing technologies. A particular emphasis is placed on the interface with functional polymeric materials.The event is open to the public and we warmly welcome students and industry professionals from diverse fields.

Symposium Details

Symposium Format and Schedule:

The symposium is a two-day event from 9:00 am – 5:00 pm each day, including boxed lunches in Kane Hall. There will be a post-symposium reception on Thursday.  On Friday, a post-symposium reception will be held on an Argosy Cruise, located at Pier 55. This three-hour event will also include an opportunity to see 3D printing in action.  A full print-friendly version of the schedule is available to download soon.

Confirmed Speakers Include:

Henrique de Amorim Almeida (Polytechnic Institute of Leiria)

Paulo Bartolo (The University of Manchester)

Annalisa Chiappone (Istituto Italiano di Tecnologia)

Paul Deffenbaugh (Sciperio, Inc.)

Michael Dickey (NC State University)

Igor Drstvenšek (University of Maribor)

Albert Folch (University of Washington)

Garret Miyake (CU-Boulder)

Howon Lee (Rutgers University)

Michael McAlpine (University of Minnesota)

Alshakim Nelson (University of Washington)

Scott T. Phillips (Penn State)

Ronald Rael (UC Berkeley)

Johanna Schwartz  (University of Washington)

 Kristina Shea (ETH Zurich)

Poster Session:

Attendees will have the opportunity participate in an afternoon poster session to present their own work in 3-D printing. Demo tables and opportunities for sponsorship are also available. Please contact Prof. AJ Boydston directly with any questions (ajb1515@uw.edu). The Royal Society of Chemistry will be sponsoring a poster prize. The winner will be announced at a special ceremony during the symposium.

Registration and Cost:

$50 per individual, $25 for UW students and students from other public or private institutions. The ticket price will grant you access to the two day-long event with complimentary lunch, the Thursday reception, and the celebratory Argosy cruise on Friday.

Thanks to support from our educational partners, all registration fees are considered tax-deductible gifts to the University of Washington. All guests will receive a gift receipt from the UW Foundation in addition to ticket confirmation. Registration is nonrefundable.

Support and Sponsors

We would like to extend our thanks to our sponsors for all of their support. Our sponsors include:

Materials Horizons

Contact: AJ Boydston (ajb1515@uw.edu)
Registration: $50 General ($25 for students)
Registration Link: http://events.uw.edu/3DPrinting2017

Conference Web Site: bit.ly/UW3DPrint2017

Printable Flyer:  UW AMFM 2017 flyer

Printed Electronics Summit

For those of you who have an interest in printed electronics, I want to let you know that the University of Washington will be hosting a Printed Electronics Summit on Tuesday and Wednesday March 7-8. The event is co-sponsored by the College of Engineering SRI teams focused on “Printed Electronics” and “Additive Manufacturing with Advanced Materials” along with several companies (including Ricoh, TEL, and DNP) that are interested in potential research collaborations.

Devin MacKenzie is the lead technical organizer.

The event will be held in Alder Commons and the Washington Clean Energy Testbed in the Bowman building. The flyer with more information about the event is attached. It is free of charge, but capacity is limited. (Planned capacity is 80, and there are 40 committed international attendees.)

2017 PE Summit Eflyer

If you would like to attend, please register using the RSVP URL below:

https://catalyst.uw.edu/webq/survey/acpittle/325501

Details

Additive Manufacturing and Functional Materials Symposium

Additive Manufacturing and Functional Materials Symposium
Thursday and Friday, June 22-23, 2017
University of Washington, Seattle

This 2-day symposium will bring together an international audience to discuss the cutting edge of additive manufacturing (AM) technologies. The symposium will focus on the interface between AM and functional polymeric materials, and will feature invited speakers and contributed posters.
Confirmed speakers include: Annalisa Chioppone (Istituto Italiano di Tecnologia), Michael Dickey (NC State), Igor Drstvenšek (University of Maribor), Howon Lee (Rutgers), Michael McAlpine (UMN), Alshakim Nelson (UW-Seattle), Eujin Pei (Brunel University London), Kristina Shea (ETH Zurich), Scott Phillips (Penn State University)

Contact: AJ Boydston (ajb1515@uw.edu)
Registration: $50 ($25 for students)
More to come soon…http://blogs.uw.edu/am2i/

UW AMFM 2017 flyer